MA4E2054D1-287T
Low Barrier Si
The MA4E2054 series are low barrier n-type silicon Schottky diodes assembled in low cost surface mount plastic packages. They are designed for use as high performance mixer and detector diodes. These parts are offered with Sn/Pb plating, as well as with 100 % matte Sn plating on the RoHS compliant part numbers. The MA4E2054-1141T (SOD-323), MA4E20541-1279 (SC-79) and the MA4E2054A and MA4E2054C (available in both the SOT-23 and SOT-323 packages) are single element Schottky diodes characterized for use as single ended mixers and detectors. The MA4E2054B and MA4E2054D (available in both the SOT-23 and SOT-323 packages) incorporate two Schottky chips in series pair configurations. The MA4E2054E-1068T consists of two Schottky chips in the SOT-143 package in an unconnected pair configuration. These diodes are useful for balanced mixer and detector voltage doubler circuits. Applications for the MA4E2054 series include VSAT and DBS mixers. The small diode package size and low cost make them attractive for use in RF tag applications for identification and toll collection. The part number consists of the base chip (MA4E2054), followed by the wiring configuration (A, B, C, D, E, omit for SOD-323), the package style (287, 1068, 1141, 1146) and a “T” for tape and reel.
Product Specifications
- Part Number
- MA4E2054D1-287T
- Description
- Low Barrier Si
- Vf(V)
- -0.7500
- Vb
- 3.00
- Total Capacitance(pF)
- 0.300
- Dynamic Resistance(ohms)
- 17.0
- Junction Capacitance(pF)
- 0.150
Features
- Low IR (<100nA @ 1V, <500nA @ 3V)
- Tape and Reel
- Lead Free
- Single, Series Pair, and Unconnected Pair Configurations
- Low 1/F Noise
- Low Capacitance: 0.30 pF
- High Detector Sensitivity: -55 dBm TSS
- Designed for High Volume, Low Cost Detector and Mixer Applications
- 260°C Reflow Compatible
- RoHS Compliant
Technical Resources
Application Notes
- S-Parameter S2P File Format Guide
- Tape and Reel Packaging for Surface Mount Components
- Surfacing Mounting Instructions - Footprint Guidelines
- Moisture Effects on the Soldering of Plastic Encapsulated Devices
- Principles, Applications and Selection of Receiving Diodes