MA4FCP300
Si PIN Diode
MACOM’s MA4FCP Series consists of Silicon Flip Chip PIN diodes fabricated with MACOM’s patented HMIC process. This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics. This diode is fully passivated with Silicon Nitride and has an additional layer of Polyimide for scratch protection. These protective coatings prevent damage to the junction during automated or manual handling. This flip chip configuration is suitable for pick and place insertion. The small 0315 outline and low 0.12 pS RC product, make the device useful for multi-throw switch and switched phase shifter circuits requiring < 40 nS switching speeds up to 18 GHz operating frequency.
Product Specifications
- Part Number
- MA4FCP300
- Description
- Si PIN Diode
- Breakdown Voltage, Minimum(V)
- 70
- Resistance(Ohm)
- 2.60
- Total Capacitance(pF)
- 0.030
- CW Power Dissipation(W)
- 0.2
- Thermal Resistance(°C/W)
- 450.0
- Min Frequency(MHz)
- 100
- Max Frequency(MHz)
- 30000
Features
- Lower Series Resistance : 2.6 O
- Polyimide Scratch Protection
- Silicon Nitride Reliability Passivation
- Faster Switching Speed : 40 nS
- Lower Capacitance : 40 fF
- Designed for Automated Pick and Place Insertion •
- Rugged by Design
Applications
- ISM
Technical Resources
Datasheet
Application Notes
- S-Parameter S2P File Format Guide
- Known Good Die Delivery Specification
- Bonding, Handling, and Mounting Procedures for Chip Diode Devices
- Design with PIN Diodes
- Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
- Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches