MA4P504-132
PIN Diode
MACOM'S broad line of packaged PIN diodes encompass a comprehensive range of electrical characteristics and package outlines. This diverse union of semiconductor technology and chip packaging gives considerable flexibility to the circuit designer. The fast switching series of Packaged PIN Diodes utilize a thin I-region, silicon oxide or glass passivated chip which provides for low leakage current and low insertion loss. With the use of in process control monitors to regulate wafer fabrication parameters, these devices will achieve consistent performance in control circuit applications. The high voltage product line of Packaged PIN Diodes employs MACOM's CERMACHIP® passivation process which provides for a hard glass encapsulation that hermetically seals and protects the active area of the chip. These packaged CERMACHIP® PIN diodes are ideally suited for use in high power applications where high level RF voltages are present. The diode chips are bonded into sealed ceramic packages that are designed for the most stringent electrical and environmental conditions. An extensive choice of package styles are available which may be used in a wide variety of RF microwave circuits. The Packaged PIN Diodes series are designed to have a high inherent reliability and may be ordered screened to meet many MIL-STD requirements.
Product Specifications
- Part Number
- MA4P504-132
- Description
- PIN Diode
- Breakdown Voltage, Minimum(V)
- 500
- Resistance(Ohm)
- 0.60
- Total Capacitance(pF)
- 0.200
- CW Power Dissipation(W)
- 7.5
- Thermal Resistance(°C/W)
- 20.0
- Min Frequency(MHz)
- 1
- Max Frequency(MHz)
- 10000
Features
- Switch & Attenuator Die
- RoHS Compliant
- High Isolation
- Low Loss
- Fast Switching Speed
- Voltage Ratings to 3000V
- Oxide Passivated Planar Chips
- Glass Passivated CERMACHIP®
- Hermetic
- Extensive Selection of I-Region Lengths
Technical Resources
Datasheet
Model Data (Sparameters)
Application Notes
- S-Parameter S2P File Format Guide
- Known Good Die Delivery Specification
- Bonding, Handling, and Mounting Procedures for Chip Diode Devices
- Design with PIN Diodes
- Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
- Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches
ADS & SPICE Model Info
Technology Partners
