MA4P7470F-1072T
Non-Magnetic MELF for MRI
The MA4P7470F-1072T is a surface mountable PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The device incorporates MACOM's time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes MACOM's new non-magnetic plating process to provide a hermetically sealed package with extremely low permeability. Incorporated within the package is a glass passivated PIN chip that is full face bonded on both the cathode and anode to maximize surface area for low electrical and thermal resistance. The low thermal resistance provides excellent performance at high incident power levels of up to 200 watts CW. The MA4P7470F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. The MA4P7470F-1072T is a non-magnetic device which has similar electrical performance to its magnetic counterpart the MA4P7417F-1072T. The diode is well suited for use in low loss, low distortion, high power switching circuits. It was designed to be used in a high magnetic field environment from HF through UHF frequencies. This device is designed to meet the most rigorous electrical and mechanical requirements of MRI environments.
Product Specifications
- Part Number
- MA4P7470F-1072T
- Description
- Non-Magnetic MELF for MRI
- Breakdown Voltage, Minimum(V)
- 800
- Resistance(Ohm)
- 0.80
- Total Capacitance(pF)
- 0.700
- CW Power Dissipation(W)
- 12.0
- Thermal Resistance(°C/W)
- 13.0
- Min Frequency(MHz)
- 0
- Max Frequency(MHz)
- 1500
Features
- Non-Magnetic Package Suitable for MRI Applications
- RoHS Compliant
- High Average Incident Power Handling Capability
- Low Cj for High Series Isolation
- Long tL for Low Intermodulation Distortion
- Low Rs for Low Insertion Loss
- Hermetically Sealed
- Rectangular MELF SMQ Ceramic Package
Technical Resources
Datasheet
Model Data (Sparameters)
Application Notes
- S-Parameter S2P File Format Guide
- Tape and Reel Packaging for Surface Mount Components
- Design with PIN Diodes
- Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
- Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches