MA4SPS402

Surmount PIN Diode

This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These surmount devices are suitable for usage in moderate incident power (5W C.W.) or higher incident peak power (50W) series, shunt, or series-shunt switches. Lower parasitic inductance, 0.45nH, and excellent RC constant (0.23pS), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts.

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Product Specifications

Part Number: MA4SPS402
Description: Surmount PIN Diode
Breakdown Voltage, Minimum(V): 100
Resistance(Ohm): 5.00
Total Capacitance(pF): 0.040
CW Power Dissipation(W): 1.0
Thermal Resistance(°C/W): 150.0
Min Frequency(MHz): 50
Max Frequency(MHz): 18000

Features

Surface Mount
RoHS Compliant
Higher Average and Peak Power Handling
Low Parasitic Capacitance and Inductance
Polymer Scratch Protection
Silicon Nitride Passivation
Rugged Silicon-Glass Construction
No Wire Bonding Required

Technical Resources

Datasheet

MA4SPS402.pdf

Model Data (Sparameters)

MA4SPS402 S-Parameters

Application Notes

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MA4SPS402

Diode,Switch,M/T,Hmic,Surface_Mount

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