MA4SPS421
Surmount PIN Diode
This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC(TM) process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These surmount devices are suitable for usage in moderate incident power (10W C.W.) or higher incident peak power (500W) series, shunt, or series-shunt switches. Lower parasitic inductance, 0.1 to 0.2nH, and excellent RC constant (0.45pS), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts.
Product Specifications
- Part Number
- MA4SPS421
- Description
- Surmount PIN Diode
- Breakdown Voltage, Minimum(V)
- 200
- Resistance(Ohm)
- 6.20
- Total Capacitance(pF)
- 0.130
- CW Power Dissipation(W)
- 1.8
- Min Frequency(MHz)
- 50
- Max Frequency(MHz)
- 6000
Technical Resources
Datasheet
Application Notes
- S-Parameter S2P File Format Guide
- Known Good Die Delivery Specification
- Bonding, Handling, and Mounting Procedures for Chip Diode Devices
- Design with PIN Diodes
- Comparison of Gallium Arsenide and Silicon PIN Diodes for High Speed Microwave Switches
- Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
- Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches