MELF PIN Diode

The MADP-000638-10910T is a surface mountable PIN diode in a Metal Electrode Leadless Faced (MELF) package. The device incorporates MACOM’s proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes MACOM’s plating process to provide a hermetically sealed package. Incorporated in the package is a glass passivated PIN chip that is full face bonded on both the cathode and anode to maximize surface area for lower series and thermal resistance. The MADP-000638-10910T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. The diode is well suited for use in low loss, low distortion, high power switching circuits and is especially de-signed for use  from HF through UHF frequencies. The low thermal resistance of this device also pro-vides excellent performance at high incident RF power levels. This device has been designed to perform well in the most rigorous electrical and mechanical  environments.