MELF PIN Diode

The chip used in the MADP-011180-10910T is manufactured using a unique, CERMACHIP, passivation process which provides for a hard glass encapsulation that protects and hermetically seals the active area of the chip. The chip is enclosed in a rugged, ceramic, Metal Electrode Leadless Faced (MELF), surface mount package that is full face bonded to refractory metal plugs on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to its symmetrical thermal paths. MELF PIN diodes are designed specifically for high volume tape and reel assembly. Their user friendly design provides for extremely easy, automatic, pick and place, indexing and assembly. All solderable surfaces are tin plated and are compatible with all industry standard reflow and vapor phase solder processes. The MADP-011180-10910T is ideally suited for use in applications where high RF and DC voltages are present. This device is well suited for use in low loss, low distortion, UHF and VHF high power switching circuits.