MMP7066-11

Silicon PIN Diode

unpackaged die suitable for use in attenuator, switch  or high-power limiter applications. It is manufactured using a proven diode manufacturing process for high reliability and uniformity. The very low thermal resistance (typically less than 20ºC/W) of this device enables it to reliably handle large RF power levels.

The low series resistance and the junction capacitance of the diode combine to produce excellent isolation and insertion loss.

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Product Specifications

Part Number
MMP7066-11
Description
Silicon PIN Diode
Breakdown Voltage, Minimum(V)
500
Resistance(Ohm)
1.20
Total Capacitance(pF)
0.100
Lifetime(nS)
2000
Thermal Resistance(°C/W)
15.0
Package
CS11
Package Category
Die
ROHS
Yes

Features

  • Low Series Resistance
  • Low Junction Capacitance
  • I-Layer Thickness: W = 70 μm

Technical Resources

Datasheet

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MMP7066-11
Die, Diode, PIN
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