MMP7066-11

Silicon PIN Diode

unpackaged die suitable for use in attenuator, switch  or high-power limiter applications. It is manufactured using a proven diode manufacturing process for high reliability and uniformity. The very low thermal resistance (typically less than 20ºC/W) of this device enables it to reliably handle large RF power levels.

The low series resistance and the junction capacitance of the diode combine to produce excellent isolation and insertion loss.

Product Specifications

Part Number
MMP7066-11
Description
Silicon PIN Diode
Breakdown Voltage, Minimum(V)
500
Resistance(Ohm)
1.20
Total Capacitance(pF)
0.100
Thermal Resistance(°C/W)
15.0

Features

  • Low Series Resistance
  • Low Junction Capacitance
  • I-Layer Thickness: W = 70 μm

Technical Resources

Datasheet


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MMP7066-11
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