Consumer & Commercial

Product Quality

Our goal is to continually deliver high-quality products and services that meet our customers’ needs in terms of delivery, performance, safety and value. Process controls are implemented such that tasks are performed properly the first time, so that products and services meet established, agreed to requirements. We believe it is the responsibility of every employee to ensure quality, customer satisfaction, continual improvement, maintenance of our quality management system and strict compliance with customer and regulatory requirements.

Certifications are as follows:

ISO 9001:2015:

International standard that specifies requirements for a QMS. Organizations use the standard to demonstrate the ability to consistently provide products and services that meet customer and regulatory requirements.

Sites: Lowell, Massachusetts; Cork, Ireland; Ithaca, New York; Santa Clara and Newport Beach, California; Morrisville, North Carolina; Ann Arbor, Michigan; Nashua, New Hampshire; Hsinchu, Taiwan.

ANSI/ESD S20.20-2014

Industry standard for the development of an Electro-Static Discharge (ESD) control program to protect today’s increasingly sensitive semiconductor devices from ESD damage.

Sites: Lowell, Massachusetts; Allentown PA; Ann Arbor, Michigan; Nashua, New Hampshire; Morrisville, North Carolina; Hsinchu, Taiwan.

Product Qualification Standards

MACOM’s product qualification testing is based on the JEDEC Standard JESD47 - Stress Test Driven Qualification of Integrated Circuits. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.

Qualification plans can include the following tests.

JEDEC Reference	Qualification Test	Purpose
JESD22-A113	Pre-conditioning	This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation.
JESD22-A108	High Temperature Operating Life (HTOL)	This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring.
JESD22-A104	Temperature Cycle (T/C)	This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes.
JESD22-A110	Temperature Humidty Bias (THB)	The purpose of this test method is to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs severe conditions of temperature, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it.
JESD22-A118	Unbiased Highly Acceleralted Stress Test (uHAST)	Unbiased HAST is performed for the purpose of evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under noncondensing conditions. Bias is not applied in this test to ensure the failure mechanisms potentially overshadowed by bias can be uncovered (e.g., galvanic corrosion).
JESD22-A103	High Temperature Storage Life (HTSL)	The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices
JS-001	Electrostatic Discharge - Human Body Model (ESD-HBM)	This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).
JS-002	Electrostatic Discharge - Charged Device Model (ESD-CDM)	This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD).

JEDEC Reference

Qualification Test

Purpose

JESD22-A113

Pre-conditioning

This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation.

JESD22-A108

High Temperature Operating Life (HTOL)

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring.

JESD22-A104

Temperature Cycle (T/C)

This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes.

JESD22-A110

Temperature Humidty Bias (THB)

The purpose of this test method is to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs severe conditions of temperature, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it.

JESD22-A118

Unbiased Highly Acceleralted Stress Test (uHAST)

Unbiased HAST is performed for the purpose of evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under noncondensing conditions. Bias is not applied in this test to ensure the failure mechanisms potentially overshadowed by bias can be uncovered (e.g., galvanic corrosion).

JESD22-A103

High Temperature Storage Life (HTSL)

The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices

JS-001

Electrostatic Discharge - Human Body Model (ESD-HBM)

This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

JS-002

Electrostatic Discharge - Charged Device Model (ESD-CDM)

This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD).